Multi-layer wiring board and method of producing same

摘要

A multi-layer wiring board is produced by laminating a plurality of insulating layers having conductor circuits, wherein the conductor circuits of the insulating layers are electrically connected together through via-holes in insulating connection layers having no conductor circuit, and the regions other than the conductor circuits of the insulating layers and the regions other than the via-holes of the connection layers are directly joined together by press-adhering the insulating resins that constitute the respective layers.