发明名称 Coating film forming apparatus
摘要 A substrate is horizontally held by a substrate holding portion freely movable in the Y-direction, and a nozzle portion is provided above and opposing the substrate, and movable in X-direction corresponding to the coating liquid feeding region of the substrate. A discharge opening is formed at a lower end of the nozzle portion, and a channel connecting the discharge opening with a coating liquid feed tube coupled to an upper end of the nozzle portion is formed within the discharge opening. At the midstream of the channel, a liquid pool portion larger in diameter than the discharge opening is formed, the inside of which is provided with a filtering member formed by porous bodies blocking the channel. The filtering member forms a pressure loss portion, which absorbs pulsation occurring at the coating liquid feed tube before it reaches the discharge opening.
申请公布号 US2003097983(A1) 申请公布日期 2003.05.29
申请号 US20020298932 申请日期 2002.11.19
申请人 TOKYO ELECTRON LIMITED 发明人 KITANO TAKAHIRO;KOGA NORIHISA;TAKEI TOSHICHIKA;KAWAFUCHI YOSHIYUKI
分类号 H01L21/30;B05B13/04;B05C5/02;B05C11/10;H01L21/00;(IPC1-7):B05C11/00 主分类号 H01L21/30
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