Joining structure of heat-radiating plate and optoelectronic heat-emitting device

摘要

The present invention provides a joining structure of heat-radiating plate and optoelectronic heat-emitting device, which comprises an optoelectronic heat-emitting device, a heat radiator, and a thermal conductive material. The top face of the optoelectronic heat-emitting device is joined with the bottom face of the heat radiator. A receiving space is disposed on the bottom face of the heat radiator. The thermal conductive material is placed in the receiving space. The area of the top face of the optoelectronic heat-emitting device is smaller than that of the receiving space so that the top face of the optoelectronic heat-emitting device can contact the thermal conductive material in the receiving space. The thermal conductive material can melt into liquid to have good fluidity after being uniformly heated to fill up the gap between the heat radiator and the optoelectronic heat-emitting device, thereby effectively helping the optoelectronic heat-emitting device quickly radiate out heat.