发明名称 Wire bonding apparatus
摘要 A wire bonding apparatus including a bonding tool that performs bonding on a bonding part, a position detection camera which has a lens barrel and images the bonding part, a light source which emits illuminating light downward through the lens barrel, and a light path conversion device that directs an image of an area near the lower end of the tool to the position detection camera. The light path conversion device includes a wavelength-selective filter that is provided so as to be within a light path of the image of the area near the lower end of the tool. The wavelength-selective filter allows illuminating light of the light path conversion device to pass therethrough but prevents the illuminating light from the lens barrel side from passing therethrough.
申请公布号 US2003099049(A1) 申请公布日期 2003.05.29
申请号 US20020307080 申请日期 2002.11.27
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 HAYATA SHIGERU
分类号 H01L21/60;B23K20/00;H01L21/00;(IPC1-7):G02B5/22 主分类号 H01L21/60
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