| 发明名称 |
Sawing method of molded lead frame package, involves sawing package attached to carrier, along a dicing line formed on leads |
| 摘要 |
The molded lead frame package (MLP) (3) is attached to a carrier and mounted on a table of a dicing saw. The package is sawed along a dicing line (18) formed on several leads (16).
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| 申请公布号 |
DE10154854(A1) |
申请公布日期 |
2003.05.28 |
| 申请号 |
DE20011054854 |
申请日期 |
2001.11.08 |
| 申请人 |
CARSEM SEMICONDUCTOR SDN. BHD., IPOH |
发明人 |
HUAT, LEE KOCK;MENG, CHAN BOON;KEUNG, PHUAH KIAN;SIN, LEE HUAN;TUCK, CHEONG MUN |
| 分类号 |
H01L21/48;H01L21/60;(IPC1-7):H01L23/50 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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