RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND USE THEREOF

摘要

The present invention provides a resin composition comprising (A) at least one heat-resistant thermoplastic resin selected from the group consisting of a polyketone resin, a polyimide resin, polyethernitrile, polybenzimidazole, polyphenylene sulfide, polysulfone, polyethersulfone, polyarylate, a liquid crystal polyester resin, and 1,4-polyphenylene, and (B) a flaky inorganic filler that: (1) has a Mohs hardness of 3.0 or lower, (2) has a coefficient of linear expansion not higher than 5.0 x 10<-5>/K, (3) is chemically inert and retains a layer structure to at least 500 DEG C, and (4) has an aspect ratio (the average particle diameter/thickness ratio) of 10 or higher; a formed article thereof; and a substrate film for printed circuit boards as use thereof.