| 摘要 |
<p>The present invention relates to a power module in which an insulated circuit board is fixed to one main surface of a heat discharge plate. It is an object thereof to provide a power module in which the heat discharge characteristics are improved without any marked warping being generated, and that has an extended heat cycle longevity. In the power module 10 of the present invention, a square insulated circuit board12 is fixed to one main surface of a heat discharge plate 11. The heat discharge plate 11 is formed of an Al based alloy plate having a thickness A of 3 to 10 mm, and the insulated circuit board 12 having a side B of 30 mm or less in length is brazed directly onto the heat discharge plate 11. It is preferable that the brazing material used is one or two or more brazing materials selected from Al-Si, Al-Ge, Al-Cu, Al-Mg, and Al-Mn based brazing materials. It is also preferable that the insulated circuit board 12 is formed by a ceramic substrate 12a and Al plates 12b and 12c that are bonded to both surfaces thereof, and that the Al plate 12b has a purity of 99.98 or greater percent by weight. <IMAGE></p> |
