发明名称 Palladium Plating Solution
摘要 A palladium plating solution, characterized in that it comprises a soluble palladium salt in an amount of 0.1 to 40.0 g/liter in terms of palladium, 0.01 to 10 g/liter of a pyridine-carboxylic acid and/or at least one selected from among a soluble iron salt, zinc salt, thallium salt and tellurium salt and the like in an amount of 0.002 to 1.0 g/liter in terms of metal, 0.005 to 10 g/liter of amine derivative of pyridine-carboxylic acid, an aldehydobenzoic acid derivative, and 0.001 to 1.2 g/liter of an anionic surfactant or an amphoteric surfactant. The palladium plating solution allows the preparation of a highly pure and stable palladium precipitate which is excellent in specular gloss, forms a plating film having a thickness of 5 žm or more and is free from the occurrence of a crack.
申请公布号 GB2382353(A) 申请公布日期 2003.05.28
申请号 GB20010028788 申请日期 2001.06.15
申请人 * KOJIMA CHEMICALS CO LTD 发明人 TAKEUMI * AKIMOTO
分类号 C25D3/50;C25D3/52;C25D3/56 主分类号 C25D3/50
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