| 摘要 |
<p>A method and device for through-hole plating of flexible substrates (1), especially printed circuit boards, by means of two electrically conductive contact areas (4,41) on opposite-lying surfaces (1a,1b) of the substrate. A cut (11) is made in the region of the contact areas in a slanted position with respect to the surfaces of the substrate and the two substrate areas (20,30) adjacent to the slanted cut are displaced until they interlock with each other. Said displacement is carried out by means of a tappet (12) with impingement of compressed area (13) and the application of a low pressure (14) or by means of a driver hook (15) fixed on the cutting tool. The two steps involving the production of the cut and displacement of the two substrate areas adjacent to the hut are carried out in a single work process.</p> |
