EPOXY RESIN COMPOSITION FOR SEALING OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: Provided is an epoxy resin composition for sealing of semiconductor device which does not cause crack or interface separation, even in high temperature solder reflow process, and can ensure high reliability of package. CONSTITUTION: The epoxy resin composition comprising epoxy resin, phenol hardener and inorganic filler, is characterized in that the epoxy resin is at least one of compounds represented by formulas 4 and 5, or a mixture of the compounds(formulas 4 and 5) with at least components selected from the group consisting of ortho-cresol novolac type of epoxy resin, biphenyl type of epoxy resin, polyfunctional epoxy resin, naphthalene type of epoxy resin, and dicyclopentadiene type of epoxy resin; and the hardener is at least one of compounds represented by formulas 4 and 5, or a mixture of the compounds(formulas 4 and 5) with at least components selected from the group consisting of novolac type of phenol resin, xyloc type of phenol resin, polyfunctional phenol resin, naphthalene type of phenol resin, and dicyclopentadiene type of phenol resin. The epoxy resin composition necessarily comprises the compounds represented by formulas 4 and 5.