Thermoformable polymides.

摘要

A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 s<-1 >is greater than 1000 Pas and a shear velocity of 1000 s<-1 >is less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.