| 摘要 |
According to a molding method for the conductive plate of this invention, a substrate (11) having through holes (11b) each corresponding to each protruded portion (12, 13) is employed and the substrate (11) is sandwiched between both dies (23, 26). Then raw powder (10a) is filled into each housing portion (23b, 26b) provided opposing each through hole (11b) in the substrate (11) provided in each of both dies (23, 26), through the through hole (11b) in order to form each protruded portion (12, 13). Then the protruded portion (12, 13) is formed integrally with the substrate (11) by heating the raw powder (10a) under pressure. <IMAGE> <IMAGE> |
