摘要 |
<p>The LED arrangement includes at least one LED chip with surface contact metallisation connected to a first electrical conductor. The electrical conductors, e.g. conductor tracks, are arranged on a transparent conductor track carrier fixed to the LED chip. The chip also has contact metallisation on its bottom surface which is connected to a second electrical conductor on a second carrier. A free intermediate space between the light output surface of the LED chip and the first conductor carrier is filled with an optical coupling medium. The LED arrangement preferably includes several LED chips arranged in rows and columns.</p> |