发明名称 LED arrangement including LED chip for display - has surface contact metallisation on chip connected to electrical conductors on transparent conductor track carrier fixed to chip
摘要 <p>The LED arrangement includes at least one LED chip with surface contact metallisation connected to a first electrical conductor. The electrical conductors, e.g. conductor tracks, are arranged on a transparent conductor track carrier fixed to the LED chip. The chip also has contact metallisation on its bottom surface which is connected to a second electrical conductor on a second carrier. A free intermediate space between the light output surface of the LED chip and the first conductor carrier is filled with an optical coupling medium. The LED arrangement preferably includes several LED chips arranged in rows and columns.</p>
申请公布号 DE29624411(U1) 申请公布日期 2003.05.28
申请号 DE1996224411U 申请日期 1996.01.31
申请人 SIEMENS AG 发明人
分类号 G09F9/33;H01L25/075;H01L33/38;H01L33/40;(IPC1-7):H01L25/075;G09F9/30;H01L23/485 主分类号 G09F9/33
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