WAFER LEVEL PACKAGE FOR OPTICAL DEVICE AND PACKAGING METHOD THEREOF

摘要

PURPOSE: A wafer level package for an optical device is provided to efficiently deal with an optical device having several hundreds of microns in width, length and thickness and easily perform an optical module packaging process by providing a standardized optical device packaging method not affected by the size of the optical device through a wafer level package process. CONSTITUTION: A wafer(1) is prepared. The optical device(7) exposes a bonding pad(5), attached and fixed to the upper portion of the wafer by using adhesive(3). A passivation layer(9) protects and supports the optical device in parallel with the surface of the optical device, formed on the wafer. A redistribution pad(11) is formed on the passivation layer, electrically connected to the bonding pad.