| 摘要 |
PROBLEM TO BE SOLVED: To provide epoxy resin composition tablets for sealing semiconductors excellent in decrease of voids and packing property. SOLUTION: The epoxy resin composition tablets consist essentially of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator and (D) an inorganic filler. In the tablets, the specific gravity of a sheet after mixing and kneading these components is >=98% based on the specific gravity of the molded article and the specific gravity of tablets obtained by pulverizing and tableting the sheet is >=98% based on the specific gravity of the molded article.
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