Semiconductor wafer finishing control

摘要

A method of in situ control for finishing semiconductor wafers to improve cost of ownership is discussed. A method to use business calculations combined with physical measurements to improve control. The use of boundary lubricating layer control in the operative finishing interface and business calculations to improve the cost of finishing semiconductor wafers is discussed. The method aids control of differential lubricating boundary layers and improved differential finishing of semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.