发明名称 Lead configurations
摘要 A microelectronic lead element includes an elongated first leg having a surface releasably attached to a substrate. The first leg has a tip end and a base end. An elongated second leg includes a surface releasably attached to a substrate, the second leg having a tip end and a base end. The base end of the first leg is arranged adjacent the base end of the second leg. A body of conductive material is adapted for electrically connecting the base ends of the first and second legs together. The first and second legs extend away from their respective base ends and said body of conductive material in a common direction. Movement of the tip ends relative to each other in a vertical direction relative to the substrate causes flexure of the first and second legs in opposite directions upon release from the substrate.
申请公布号 US6570101(B2) 申请公布日期 2003.05.27
申请号 US20010858847 申请日期 2001.05.16
申请人 TESSERA, INC. 发明人 STEFANO THOMAS DI;SMITH JOHN W.
分类号 H01L21/60;H01L23/498;H01R12/04;H01R13/24;(IPC1-7):H01R12/04;H05K1/11 主分类号 H01L21/60
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