发明名称 |
Structure for high speed printed wiring boards with multiple differential impedance-controlled layer |
摘要 |
A method and arrangement for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, there are provided vias of either through-holes, blind holes and buried holes filled with a conductive paste material to form electrical interconnections with conductive layers of the printed wiring board.
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申请公布号 |
US6570102(B2) |
申请公布日期 |
2003.05.27 |
申请号 |
US20010878533 |
申请日期 |
2001.06.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MILLER THOMAS RICHARD;PAPATHOMAS KONSTANTINOS I.;CURCIO BRIAN EUGENE;SNIEZEK JOSEPH J. |
分类号 |
H01L23/498;H01L23/66;H05K1/02;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):H01R12/04;H05K1/11 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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