发明名称 Single-piece molded module housing
摘要 An adapter or housing for a module, such as a single in-line memory module (SIMM) or the like, and method of using the same are herein disclosed where the SIMM and attached housing fit a predetermined-shape SIMM socket. The housing replaces SIMM board material that would otherwise be used to help secure the SIMM to a predetermined-shape SIMM socket or connector. The configuration of the housing allows a SIMM or the like to be snapped or slid and secured into the housing. If desired, an adhesive potting material and/or other bonding material can be used to secure the SIMM board to the housing and/or pot the SIMM within the housing.
申请公布号 US6570771(B2) 申请公布日期 2003.05.27
申请号 US20000737288 申请日期 2000.12.13
申请人 MICRON TECHNOLOGY, INC. 发明人 FARNWORTH WARREN M.;KING JERROLD L.
分类号 H01R12/16;H05K1/14;H05K3/28;H05K3/30;(IPC1-7):H05K7/14 主分类号 H01R12/16
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