发明名称 |
Structure of a ball-grid array package substrate and processes for producing thereof |
摘要 |
An improved structure of a ball-grid array (BGA) package substrate and processes for producing thereof are disclosed, wherein one side of the BGA substrate has a single pattern layer for connecting with solder balls and a heat sink layer is bonded to the other side of the substrate. The heat sink layer provides not only heat dissipation for the substrate, but also patterns for power and/or for ground, so as to diminish the dimension required for the patterns for power and/or for ground on the pattern layer of the substrate. The solder balls for power and/or for ground of the substrate are connected with the heat sink layer through electrically and thermally conductive via holes plugged with conductive paste.
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申请公布号 |
US6569712(B2) |
申请公布日期 |
2003.05.27 |
申请号 |
US20020083105 |
申请日期 |
2002.02.27 |
申请人 |
VIA TECHNOLOGIES, INC. |
发明人 |
HO KWUN-YAO;KUNG MORISS;TUNG LIN-CHOU;FU JACKIE |
分类号 |
H01L23/31;H01L23/36;H01L23/42;H01L23/495;H05K1/02;H05K1/11;H05K3/40;(IPC1-7):H01L21/48 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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