发明名称 Lead-free solder powder material, lead-free solder paste and a method for preparing same
摘要 Lead-free solder metal powder material including two or more metals capable of forming an intermetallic compound and having an unreacted phase and an amorphous phase. Further, a lead-free solder paste is prepared by mixing the powder material with a soldering flux. The powder material is preferably formed using a mechanical milling process.
申请公布号 US6569262(B1) 申请公布日期 2003.05.27
申请号 US20000511478 申请日期 2000.02.23
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SHOHJI IKUO
分类号 B02C17/04;B22F1/00;B22F9/02;B23K35/00;B23K35/02;B23K35/26;B23K35/30;B23K35/40;H05K3/34;(IPC1-7):B23K35/24 主分类号 B02C17/04
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