发明名称 |
Lead-free solder powder material, lead-free solder paste and a method for preparing same |
摘要 |
Lead-free solder metal powder material including two or more metals capable of forming an intermetallic compound and having an unreacted phase and an amorphous phase. Further, a lead-free solder paste is prepared by mixing the powder material with a soldering flux. The powder material is preferably formed using a mechanical milling process.
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申请公布号 |
US6569262(B1) |
申请公布日期 |
2003.05.27 |
申请号 |
US20000511478 |
申请日期 |
2000.02.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SHOHJI IKUO |
分类号 |
B02C17/04;B22F1/00;B22F9/02;B23K35/00;B23K35/02;B23K35/26;B23K35/30;B23K35/40;H05K3/34;(IPC1-7):B23K35/24 |
主分类号 |
B02C17/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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