发明名称 BONDING METHOD AND APPARATUS FOR PACKAGING MATERIAL
摘要 PROBLEM TO BE SOLVED: To effectively obtain a high quality packaged item by exactly preventing an adhesive agent from protruding by use of a simple process and construction. SOLUTION: The edge potion 5a of the packaged item 4a is clamped by an upper heater 102a and a lower heater 104a. The temperature of the lower heater 104a is set at a temperature not lower than a fusion temperature of a sealant material 7 mounted on the packaged item 4a while the temperature of the upper heater 102a is set at a temperature lower than the fusion temperature of the sealant material 7.
申请公布号 JP2003155004(A) 申请公布日期 2003.05.27
申请号 JP20010350501 申请日期 2001.11.15
申请人 FUJI PHOTO FILM CO LTD 发明人 TSUCHIYA TADAO;KOZUTA NAOKI;SATO IKUHISA
分类号 B65B51/10 主分类号 B65B51/10
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