发明名称 Method and apparatus for placing identifying mark on semiconductor wafer
摘要 A tool for placing an identifying mark on a semiconductor wafer has a bundle of optical fibers that can be illuminated in a pattern representing an identifying character. Light from the fibers is focused on a photoresist layer during wafer manufacture and a pattern of dots is etched into the wafer to represent the character. The dots are too small to be seen with the human eye but the character can be read by a human or by a machine. The character is etched as part of a conventional etch step in manufacturing the wafer and it is easily repeated as a series of manufacturing steps obscure the original mark.
申请公布号 US6570642(B2) 申请公布日期 2003.05.27
申请号 US20010920605 申请日期 2001.08.02
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 HUANG YUNG-SHENG;HSIEH HUNG-CHANG
分类号 H01L23/544;(IPC1-7):G03B27/54;G03B27/74;G03B27/42;G03B27/00 主分类号 H01L23/544
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