发明名称 LIGHT BEAM SOLDERING METHOD AND LIGHT BEAM SOLDERING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and an apparatus with which an irradiating treatment can be applied for a short time, in a light beam soldering method and a light beam soldering apparatus irradiating a plurality of cream solders (S) coated on a base material (W) to be treated. SOLUTION: In the irradiation of the plurality of cream solders (S) coated on the base material (W) to be treated, the converged light beam irradiating from a light beam irradiating part (1), is introduced into a cylindrical member (3) having a reflecting characteristic in the inner surface. This irradiating treatment is peculiarly applied by setting the above cylindrical member (3) to the opening part and the length, with which the irradiating treatment can be applied at a position widened into such optimum range so as to collectively irradiate the plurality of cream solders (S) on the base material (W) to be treated after converging the irradiating light beam from this light beam irradiating part (1) at least at once.</p>
申请公布号 JP2003154451(A) 申请公布日期 2003.05.27
申请号 JP20010350140 申请日期 2001.11.15
申请人 USHIO INC 发明人 MOROOKA MASARU;MIKAMI MASAYOSHI
分类号 B23K1/005;B23K101/42;H05K3/34;(IPC1-7):B23K1/005 主分类号 B23K1/005
代理机构 代理人
主权项
地址