发明名称 |
Device and method for manufacturing semiconductor |
摘要 |
A heat exchange section (72) is provided in the middle of a circulation water path (58, 59) connecting between a temperature-controlled water tank (71) and a semiconductor manufacturing apparatus body (4) so as to perform a heat exchange with air of a clean room (3). The heat exchange section (72) is installed near an exit of an air circulation path (32) above a fan-filter unit (34) of the clean room as a temperature stabilized area off an atmosphere of the clean room (3). Additionally, as another method, a temperature of a chemical fluid from a chemical fluid tank (6) is controlled to be a temperature of the air in the clean room by a heat exchange section (61) provided in a location the same as above without using the temperature-controlled water so as to supply the chemical fluid to the semiconductor manufacturing apparatus body (4).
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申请公布号 |
US6569696(B2) |
申请公布日期 |
2003.05.27 |
申请号 |
US20020148664 |
申请日期 |
2002.06.04 |
申请人 |
TOKYO ELECTRON LIMITED;TAISEI CORPORATION |
发明人 |
SUENAGA OSAMU;YAMAMOTO MAKOTO;MORI NAOKI;ITO HIROMU;KOBAYASHI SADAO |
分类号 |
G03F7/30;F24F3/16;F24F5/00;H01L21/00;H01L21/02;H01L21/027;(IPC1-7):G01R31/26;H01L21/66;B01L1/04 |
主分类号 |
G03F7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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