发明名称 Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor
摘要 The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The polishing agent for processing semiconductor comprises a compound having glucose structure, polishing particles and water.
申请公布号 US6568996(B2) 申请公布日期 2003.05.27
申请号 US20010837323 申请日期 2001.04.19
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KOBAYASHI TOSHIO;TOYOSHIMA TOSHIYUKI;NAGAE SUGURU;IWASAKI MASANOBU;TSUTAHARA KOUICHIROU;HASEGAWA SHIN
分类号 B24B37/00;B01F17/42;B01F17/56;B24B37/04;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;H01L21/321;(IPC1-7):C09K3/14 主分类号 B24B37/00
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