发明名称 |
Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductor |
摘要 |
The object of the present invention is to provide a polishing agent for processing semiconductor, which can control coagulation and sedimentation and has stable and re-productive polishing properties under a proper dispersing condition to prevent generation of polishing flaw. The polishing agent for processing semiconductor comprises a compound having glucose structure, polishing particles and water. |
申请公布号 |
US6568996(B2) |
申请公布日期 |
2003.05.27 |
申请号 |
US20010837323 |
申请日期 |
2001.04.19 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KOBAYASHI TOSHIO;TOYOSHIMA TOSHIYUKI;NAGAE SUGURU;IWASAKI MASANOBU;TSUTAHARA KOUICHIROU;HASEGAWA SHIN |
分类号 |
B24B37/00;B01F17/42;B01F17/56;B24B37/04;C09G1/02;C09K3/14;H01L21/304;H01L21/3105;H01L21/321;(IPC1-7):C09K3/14 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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