发明名称 HANDLER FOR BURN-IN TEST DEVICE AND METHOD FOR TRANSFERRING SEMICONDUCTOR PACKAGE USING THE SAME
摘要 PURPOSE: A handler for burn-in test device and a method for transferring a semiconductor package using the same are provided to enhance the efficiency and the productivity by using a conversion device in an unloading process from or a loading process to a burn-in board. CONSTITUTION: The first and the second tray transferring portions(210,250) transfer the first and the second trays(211,251). The first and the fourth transferring heads(271,274) transfers a semiconductor package(1) from the first and the second trays to the first and the second DC test devices(220a,220b), respectively. The first pocket(240a) is connected with the first DC test device. The first conversion device(283a) changes each position of the first DC test device and the first pocket each other. The second pocket(240b) is connected with the second DC test device. The second conversion device(283b) changes each position of the second DC test device and the second pocket each other. The first and the second pockets corresponds to the second and the third transferring heads(272,273). A burn-in board(230) is installed between the first and the second pockets.
申请公布号 KR20030041529(A) 申请公布日期 2003.05.27
申请号 KR20010072349 申请日期 2001.11.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAE, SANG GUK;JUNG, RAPHAEL
分类号 G01R31/26;H01L21/66;(IPC1-7):G01R31/26 主分类号 G01R31/26
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