发明名称 VACUUM FORMING EQUIPMENT FOR SEMICONDUCTOR FABRICATION EQUIPMENT
摘要 PURPOSE: A vacuum forming equipment for semiconductor fabrication equipment is provided to prevent a damage of an impeller of a turbo pump by forming a structure for venting the inside of the turbo pump. CONSTITUTION: A turbo pump(3') and a dry pump(5') are installed on a vacuum line(7'). The first and the second throttle valves(9a',9b') are installed on the vacuum line in order to control the internal pressure of a process chamber(1'). The first to the third isolation valves(11a',11b',11c') are used for opening or shutting the vacuum line in order to isolate the process chamber from the turbo pump and the dry pump. An exhaust line(13') and an exhaust valve(15') are installed at one side of the process chamber. A purge line(17') is connected with the turbo pump. A purge valve is installed at the purge line in order to supply nitrogen to the turbo pump. A turbo pump vent portion(20') is formed with a vent line(21') and a vent valve(23').
申请公布号 KR20030041560(A) 申请公布日期 2003.05.27
申请号 KR20010072393 申请日期 2001.11.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, GWANG HYEON
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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