发明名称 Method and apparatus for electrically measuring insulating film thickness
摘要 A method and an apparatus for measuring insulating film thickness, such as the width of sidewall spacers. The method includes positioning a first test structure having a first resistance at a first location on a semiconductor wafer and positioning a second test structure having a second resistance different from the first resistance at a second location on the semiconductor wafer. The method also includes measuring the first resistance of the first test structure and measuring the second resistance of the second test structure. The method also includes determining an average characteristic of the first test structure and the second test structure, other than resistance, based on the first resistance of the first test structure and the second resistance of the second test structure.
申请公布号 US6570228(B1) 申请公布日期 2003.05.27
申请号 US20020052060 申请日期 2002.01.17
申请人 ADVANCED MICRO DEVICES, INC. 发明人 FUSELIER MARK BRANDON;WILLIAMS ROGER THOMAS;FENSKE MICHAEL VERNE
分类号 H01L21/66;(IPC1-7):H01L21/823 主分类号 H01L21/66
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