发明名称 |
Transducer packaging assembly for use in sensing unit subjected to high G forces |
摘要 |
A transducer packaging assembly for use in a sensing unit subjected to high forces of acceleration includes a base having a cavity. A pressure sensitive semiconductor die is bonded to a large backplate having a shape so that it nestles into the cavity but is spaced from a surface of the cavity. A planar cover secured to the base has a hole larger than the die but smaller than the backplate, and thin wires extend from the die to electrical connections on the assembly. A viscous fluid fills a space between the backplate and the cavity, and a space between the backplate and the cover, and transmits a pressure to be measured to the pressure sensitive die. The viscous fluid has a sufficiently high viscosity to oppose movement of the backplate relative to the cavity while cushioning the pressure sensitive die and the backplate from forces of acceleration.
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申请公布号 |
US6570485(B1) |
申请公布日期 |
2003.05.27 |
申请号 |
US20000715480 |
申请日期 |
2000.11.17 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
STRATTON THOMAS G.;BENDER TERRENCE D.;BODIN JOEL J.;CIGLENEC REINHART;ESPINOSA FRANK F.;MALLISON EDGAR R. |
分类号 |
G01L19/14;G01L9/00;G01L19/04;G01L19/06;(IPC1-7):H01L6/10 |
主分类号 |
G01L19/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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