发明名称 PACKAGING BODY WITH IC TAG, AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a packaging body with an IC tag which can prevent an IC chip from being broken and a working device from being damaged, in a manufacturing step, and a manufacturing method thereof. SOLUTION: The packaging body 1 with the IC tag has an IC tag with the non-contact communication function, an antenna formed of conductive ink printed in an arbitrary pattern on a part of at least a base film or a sheet, an IC tag label 2 fitted to the surface with the antenna printed thereon, and a laminate with a sealant film 3 laminated thereon formed on a label base material side of the IC tag label. The sealant film can be laminated via an adhesive or an anchor coat. In a manufacturing method of the packaging body with the IC tag, an IC chip of the IC tag label 2 is fitted facing the base material film 1b or the sheet, and machined.
申请公布号 JP2003155062(A) 申请公布日期 2003.05.27
申请号 JP20010354026 申请日期 2001.11.20
申请人 DAINIPPON PRINTING CO LTD 发明人 SHIINA TOKUYUKI
分类号 B42D15/10;B65D65/40;B65D75/54;G06K19/07;G06K19/077;G09F3/00;G09F3/18 主分类号 B42D15/10
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