SEMICONDUCTOR CHIP PACKAGE HAVING SEMICONDUCTOR CHIP ON INNER LEAD

摘要

PURPOSE: A semiconductor chip package having a semiconductor chip on an inner lead is provided to reduce the length of a bonding wire by removing a gap between the semiconductor chip and the inner lead. CONSTITUTION: A semiconductor chip(202) includes a plurality of bonding pads(204). A plurality of inner leads(206) are formed on a lead frame on which the semiconductor chip is adhered. The inner leads are electrically connected with the bonding pads. A plurality of bonding wires(212) are used for connecting electrically the bonding pads with the inner leads. An insulating adhesive member(210) is used for adhering the inner leads to the semiconductor chip. A plurality of outer leads(208) and the inner leads are formed with one body. A package body(214) is used for covering the semiconductor chip, the inner leads, the insulating adhesive member, and the bonding wires.