| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is improved in packaging density for mounted electronic parts and can obtain excellent physical property values in electrical characteristics, such as the insulation property, etc., and in which the electronic parts are embedded by using an embedding resin made to suppress the irregular reflection, etc., of light and to become inconspicuous in color shading when cured. SOLUTION: In this wiring board, the electronic parts are embedded by using the embedding resin having a dielectric constant of <5 and tanδ of <0.08. It is preferable that the embedding resin contains carbon black in an amount of <1.4 mass%. It is also preferable that the resin component of the embedding resin contains a thermosetting resin and at least one or more kinds of inorganic fillers. |
