| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems that, in the conventional light emitting device using a molded three-dimensional circuit body, the bondability between a metallic layer for electrode formed on the surface of an insulating substrate and a light emitting element is poor, because the metallic layer is composed of a glossy metallic layer and, in addition, a large amount of man-hours is required when the light emitting device is protected with a transparent resin and the luminous efficiency of the device is lowered due to the leakage of emitted light. SOLUTION: The glossy metallic layer is made to satisfy both a reflection characteristic and the bondability with the light emitting element by forming the layer in the recessed section of the molded three-dimensional circuit body and a metallic layer having superior bondability on the upper surface of the metallic layer. In addition, the working on the light emitting device is facilitated and the deterioration in luminous efficiency of the device is reduced by forming a wall section which prevents the flowing out of the transparent resin in the outer peripheral section of the upper surface of the metallic plate. |
