HEAT DISSIPATION APPARATUS

摘要

PROBLEM TO BE SOLVED: To moderate deformation stress acting on mounting portions of the heat dissipation apparatus and respective parts, a lead terminal of each parts, land portion on the side of a printed circuit board to which the lead terminal is soldered when a plurality of electronic parts are mounted on the single heat dissipation apparatus. SOLUTION: A first mounting section 11 on which first electronic parts 1a are mounted and a second mounting section 21 on which second electronic parts 1b are mounted are coupled integrally through an easily deformable heat conduction coupling section 30 formed with silicone elastomer and the like in which aluminum oxide and boron nitride and like are mixed.