| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder which prevents alignment errors when picking up a chip, and which is inexpensive and superior in maintenance properties. SOLUTION: The die bonder is provided with a wafer mount table 10 and a wafer ring 30 rotatably holding a diced wafer 20 on the wafer mount table 10. An alignment mark 40 for alignment wafer 20 is given to the wafer mount table 10.
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