| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist-removing apparatus and its method for removing resist, even when a resist cured layer is formed through ion implantation. SOLUTION: The resist removing apparatus includes a vacuum chamber 10, a wafer-mounting stage 21 pivotally provided in a reversible state in the vacuum camber 10, and a plasma-generating means 11, mounted at an upper part of the wafer mounting stage 21 for causing the plasma to flow down onto a wafer-mounting face 21a.
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