| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple-pin power supply prove in which the inductance component of the point of the probe is reduced and power can be supplied to a high-frequency semiconductor device in which adjacent ground electrode is not disposed at a plurality of power source electrodes. SOLUTION: The multiple-pin power supply prove comprises a first solid ground surface 23 disposed on the opposite surface of a power wiring 21 brought into contact with the electrode of the device 10 to be inspected and a ground wiring 22 via an insulator 24 in such a manner that the wiring 22 is electrically connected to the first solid ground surface 23 via a through hole 25. The electrode 12 is conducted to the wiring 22 so that the first solid ground surface 23 is set to the same potential as the ground of the device 10 and the inductance component of the wiring 21 is reduced.
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