| 发明名称 |
SEMICONDUCTOR DEVICE, CSP AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of stably mounting a semiconductor element on a board. SOLUTION: A semiconductor element 1 is flip-chip mounted on a board 2, and a sealing resin 6 is filled between the board 2 and the semiconductor element 1. A shoulder 10 is formed in a fillet region 9 of the sealing resin 6.
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| 申请公布号 |
JP2003152001(A) |
申请公布日期 |
2003.05.23 |
| 申请号 |
JP20010350569 |
申请日期 |
2001.11.15 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KOJIMA TOSHIYUKI;TOMURA YOSHIHIRO;ITAGAKI MINEHIRO;SHIBATA OSAMU;SAITO RYUICHI;MITSUDA AKIFUMI |
| 分类号 |
H01L23/28;H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
H01L23/28 |
| 代理机构 |
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