发明名称 LAMINATED ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a laminated electronic part which is easily and suitably mounted on a mounting board, small in size, and high in performance. SOLUTION: Interlayer connection viaholes 51a to 51d are provided at edge centers of insulating sheets 41e to 41h respectively. The interlayer connection viaholes 51a to 51d are continuously connected one another in the direction of lamination of the insulating sheets 41a to 41i to compose a relay via conductor 51 for electrically interconnecting inductors L1 and L2 and a capacitor C2. The surface of the relay via conductor 51 is covered with a plating layer.
申请公布号 JP2003151830(A) 申请公布日期 2003.05.23
申请号 JP20010346772 申请日期 2001.11.12
申请人 MURATA MFG CO LTD 发明人 NOSAKA KOJI
分类号 H01F17/00;H01G4/40;H03H7/075;(IPC1-7):H01F17/00 主分类号 H01F17/00
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