| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-polishing apparatus which can correct distributions of film thickness and quality, as well as a polished shape changed in the radial direction. SOLUTION: Air supply paths 36, 38 for jetting air against a protective sheet are disposed on a surface of a carrier 24 opposed to the protection sheet 34. The air supply paths are connected to an air control means for controlling the amount of air to be supplied. A step of polishing a wafer W, while pressing the carrier 24 to the protective sheet 34 can be switched to a step of polishing a wafer W, while applying air pressure supplied from the air supply paths by the air control means via the protective sheet 34. |
