ELECTRONIC DEVICE, METHOD FOR SEALING THE SAME AND METHOD FOR CONNECTING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent deterioration between connected terminals or between connected wires and terminal in an electronic device such as a semiconductor device having external terminals, or a wiring substrate. SOLUTION: A sealing insulation film 9 and an external terminal 7 are included. The sealing insulation film 9 is formed on a substrate 1 and has fluidity by fusing at a first heating temperature. The external terminal 7 is formed on the substrate 7, and is connected to the other electronic devices 11 at a second heating temperature higher than the first heating temperature, and is enclosed with the sealing insulating film 9 surrounding the external terminal 7.