MULTI-CHIP PACKAGE INCLUDING PLURAL STACKED CHIPS

摘要

PURPOSE: A multi-chip package including plural stacked chips is provided to recognize plural chips as one chip by forming a decoding logic for generating chip selection signals within one chip of the multi-chip package. CONSTITUTION: A plurality of semiconductor IC chips are sequentially stacked on a semiconductor substrate. Each of the semiconductor IC chips includes a decoding logic(100,120) to generate an internal chip selection signal in response to a chip selection signal and an address applied from the outside. The semiconductor IC chips include NOR flash memory chips of the same type. In addition, the decoding logic can be formed any one chip of the semiconductor IC chips.