METHOD AND APPARATUS FOR MOUNTING ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a method and apparatus for mounting electronic parts, which is able to keep a substrate stage parallel with a pressing tool in bonding a circuit board and the electronic parts. SOLUTION: A press-contacting member 9 holding an electronic part 1 is moved toward a support member 6 while heated, so that the electronic part 1 held by the press-contacting member 9 is pressed onto a substrate 4 on the support member 6, and that the substrate-mounted surface of the support member 6 is substantially kept parallel with the end surface of the press-contacting member 9, being pressed by fluid.