| 摘要 |
PROBLEM TO BE SOLVED: To improve solder wettability by preventing any solder flow and solder void from being formed upon a printed circuit board and a heat dissipation member being joined with a solder. SOLUTION: A ceramic heat dissipation circuit board is adapted such that it comprises a ceramic insulating board 2 to one side of which there is joined a Cu or Al circuit board 3 on which a semiconductor chip is mounted, and to the other side of which a Cu or Al plate 4 is joined, and a heat dissipation member 6 of an Al-SiC composite having an Al coating film 60 on the surface thereof, and a junction layer 64 is formed on the Al coating film of the heat dissipation member 6, and further the junction layer 64 and the Cu or Al plate 4 of the ceramic insulating substrate are joined with a solder 7. In the ceramic heat dissipation circuit board, the junction layer 64 is formed into a layer chiefly comprising Ni, and average surface roughness (Ra) of the surface 65 along a central line of the same is set to range from 0.2 to 1.5μm with the thickness thereof set to range from 3 to 15μm. |
