| 摘要 |
PROBLEM TO BE SOLVED: To realize a structure in a semiconductor module such as a multi-chip module wherein heat is effectively released to a heat sink by reducing thermal resistance in a semiconductor package. SOLUTION: Areas of support portions of tabs 3B and 3B of a lead frame 3 including a heat generating element 4 mounted thereon are increased, and thermal resistance of a heat dissipation path of the heat generating element 4→tab 3B→mold resin 2 such as resin→heat sink 1 is more reduced than heat resistance released from a lead portion 3A. Since in accordance with the present invension the heat resistance of an original heat dissipation path is more reduced than that of another heat path such as the lead portion 3A, such heat can be effectively released from the heat sink being the original heat dissipation path to the outside. |
