发明名称 MULTILAYER WIRING SUBSTRATE AND ITS WIRING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate or the like capable of inhibiting a signal interference with the wiring in a wiring layer other than a wiring layer with detour-shaped wiring arranged even in the case of using the detour-shaped wiring at the time of bringing the length of wiring to a specified length. SOLUTION: In a multilayer wiring substrate provided with a plurality of wiring layers including a wiring layer with detour-shaped wiring comprising linear elements and bent elements arranged in such a manner as to adjust the length of wiring, wiring arrangement in the wiring layer other than the wiring layer with the detour-shaped wiring arranged is prohibited in a zone corresponding to the bent element and its peripheral vicinity of the detour-shaped wiring.
申请公布号 JP2003152343(A) 申请公布日期 2003.05.23
申请号 JP20010350004 申请日期 2001.11.15
申请人 CANON INC 发明人 MIZUNO HIROYUKI
分类号 H05K1/02;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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