| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize an inspection apparatus and to a shorten inspection/ measurement time in an inspection/measurement process of a semiconductor wafer. SOLUTION: The inspection apparatus has an SEM inspection unit 6, an optical inspection unit 5, and an appearance inspection unit 7. A local vacuum means 8 is provided in the SEM inspection unit, and at the same time, one X-Y stage (wafer conveyance means) 3 that is arranged opposite to each inspection unit is provided, and a semiconductor wafer 2 is conveyed among the inspection units by the X-Y stage (wafer conveyance means).
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