| 摘要 |
PROBLEM TO BE SOLVED: To reduce the occupied area of an apparatus. SOLUTION: This apparatus for wafer-edge polishing processing is constituted such that in the first-floor section 1 of a two-story construction 3, a wafer-edge polisher 10 and a dryer 30 are installed in parallel, and in the second-floor section 2, first and second cleaning apparatuses 20A, 20B are installed in parallel. In the front part of the two-story construction 3, first and second transfer machines 50A, 50B are installed, and a third transfer machine 60 is installed between the first and second cleaning apparatuses 20A, 20B, while in the front side of the first and second transfer machines 50A, 50B, a loader 40A for placing cassettes 41, 42 in which wafers 5 have been loaded, and an unloader 40B for placing cassettes 41, 42 to which the wafers 5 are to be loaded, are provided.
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