| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce loss of a signal caused by a pad of a semiconductor substrate. SOLUTION: The semiconductor device 100 is equipped with the pad 112 formed on the semiconductor substrate 110, an FET 114 which receives a signal inputted to the pad 112, a capacitor 116 which is inserted between the pad 110 and FET 114, and a switching element 122 which is connected in parallel to the capacitor 116. For a test, the switching element 122 is turned on, and the pad 112 and the gate of the FET 114 are short-circuited.
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